Sputtering and evaporation

PVD Products electron beam evaporator

This electron beam evaporator produces extremely pure films by melting a target material using a beam of high-energy electrons focused into a point. The system can reach ultra-high vacuum levels with the help of cryopump and load-lock. 

• Load lock system, with main chamber at ultra-high vacuum ~e-9 Torr using cryo pump.
• Water-cooled substrate and rotation stage.
• Substrate tilting, able to deposit thin film at different tilted angles.
• Sample can be annealed at 500°C under high vacuum level without breaking the vacuum at load lock chamber. This unique function will be the only tool at Yale.
• Six pockets which contain regular metals such as Au, Ag, Al, Cr, Cu, Nb, Ni, Pt, and Ti.
• In-situ cleaning before deposition using Ar, O₂, and H₂.
• The oxygen gas can be introduced for oxidation after metal deposition.
• Capability to process wafers with diameter up to 6 inches.