Instrument/equipment Core/facility: Yale Cleanroom Facilities

Wet benches

  1. Research Cores Directory
  2. Wet benches

Cleanroom Staff

Main Campus: Becton Engineering and Applied Science Center, 5th floor

West Campus: 100 Cleanroom Core Facility, 750 West Campus 

About the instrument

The Yale Cleanroom facilities at both Main and West Campuses provide multiple wet benches designed for chemical processing, cleaning, and etching of a wide range of materials. Each bench is configured for specific applications and is equipped with appropriate chemical waste handling and safety features.

Available to Yale researchers & external researchers

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Equipment list

  1. Resist process hood
  2. Acid hood
  3. Base hood
  4. Solvent hood
  5. RCA hood

 

Resist process hood

The resist process hood is designated for the application of photoresist and e-beam resist using integrated spin coaters. It provides a controlled environment for uniform resist coating and is suitable for standard lithographic processes.

  • Tool manager: Cleanroom staff
  • Location: Main Campus Cleanroom / West Campus Cleanroom
  • Internal rate: Included with cleanroom access

Required PPE:

  • Safety glasses
  • White nitrile gloves

Supported materials:

  • Positive photoresists
  • Negative photoresists
  • E-beam resists

 

Acid hood

The acid hood is used for surface treatment of multiple substrates, and the etching of metals, insulators, and semiconductors. Additional PPE is required to use this hood, solvents are not allowed, and extreme caution must be observed while at the hood.

  • Tool manager: Cleanroom staff
  • Location: Main Campus Cleanroom / West Campus Cleanroom
  • Internal rate: Included with cleanroom access

PPE required: 

  • Safety glasses
  • Face shield
  • Chemical apron
  • Green nitrile gloves
  • White nitrile gloves
     

Chemicals supplied:

  • Buffered oxide etch
  • Sulfuric acid (H2SO4)
  • Hydrochloric acid (HCl)
  • Hydrofluoric acid (HF)
  • Citric acid (C6H8O7)
  • Phosphoric acid (H3PO4)
  • Chrome etch
  • Nitric acid (HNO3)
  • Aqua regia (HCl + HNO3)
  • Hydrogen peroxide (H2O2)

 

Base hood

The base hood is used for surface treatment of multiple substrates, as well as the development of certain photoresists. Additional PPE is required to use this hood, solvents are not allowed, and extreme caution must be observed while at the hood.

  • Tool manager: Cleanroom staff
  • Location: Main Campus Cleanroom / West Campus Cleanroom
  • Internal rate: Included with cleanroom access

PPE required:

  • Safety glasses
  • Face shield
  • Chemical apron
  • Green nitrile gloves
  • White nitrile gloves

Chemicals Supplied:

  • Resist developers
  • Tetramethylammonium hydroxide (TMAH)
  • Ammonium hydroxide (NH4OH)
  • Hydrogen peroxide (H2O2)

 

Solvent hood

The solvent hood is used for basic wafer cleaning, photoresist removal, and other simple processes. Only basic PPE is required for this chemical hood.

  • Tool manager: Cleanroom staff
  • Location: Main Campus Cleanroom / West Campus Cleanroom
  • Internal rate: Included with cleanroom access

Required PPE:

  • Safety glasses
  • White nitrile gloves

Supplied chemicals:

  • Acetone
  • Methanol
  • Isopropyl alcohol (IPA)
  • NMP

 

RCA hood

Used for extremely clean processing, the CMOS hood is used to conduct the RCA clean technique, capable of removing all organic and metallic contaminants from silicon.

  • Tool manager: Cleanroom staff
  • Location: Main Campus Cleanroom
  • Internal rate: Included with cleanroom access

PPE required: 

  • Safety glasses
  • Face shield
  • Chemical apron
  • Green nitrile gloves
  • White nitrile gloves
     

Chemicals supplied:

  • Buffered oxide etch
  • Sulfuric acid (H2SO4)
  • Hydrochloric acid (HCl)
  • Hydrofluoric acid (HF)
  • Chrome etch
  • Hydrogen peroxide (H2O2)

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