Wet benches
Main Campus: Becton Engineering and Applied Science Center, 5th floor
West Campus: 100 Cleanroom Core Facility, 750 West Campus
About the instrument
The Yale Cleanroom facilities at both Main and West Campuses provide multiple wet benches designed for chemical processing, cleaning, and etching of a wide range of materials. Each bench is configured for specific applications and is equipped with appropriate chemical waste handling and safety features.
Available to Yale researchers & external researchers
Equipment list
Resist process hood
The resist process hood is designated for the application of photoresist and e-beam resist using integrated spin coaters. It provides a controlled environment for uniform resist coating and is suitable for standard lithographic processes.
- Tool manager: Cleanroom staff
- Location: Main Campus Cleanroom / West Campus Cleanroom
- Internal rate: Included with cleanroom access
Required PPE:
- Safety glasses
- White nitrile gloves
Supported materials:
- Positive photoresists
- Negative photoresists
- E-beam resists
Acid hood
The acid hood is used for surface treatment of multiple substrates, and the etching of metals, insulators, and semiconductors. Additional PPE is required to use this hood, solvents are not allowed, and extreme caution must be observed while at the hood.
- Tool manager: Cleanroom staff
- Location: Main Campus Cleanroom / West Campus Cleanroom
- Internal rate: Included with cleanroom access
PPE required:
- Safety glasses
- Face shield
- Chemical apron
- Green nitrile gloves
- White nitrile gloves
Chemicals supplied:
- Buffered oxide etch
- Sulfuric acid (H2SO4)
- Hydrochloric acid (HCl)
- Hydrofluoric acid (HF)
- Citric acid (C6H8O7)
- Phosphoric acid (H3PO4)
- Chrome etch
- Nitric acid (HNO3)
- Aqua regia (HCl + HNO3)
- Hydrogen peroxide (H2O2)
Base hood
The base hood is used for surface treatment of multiple substrates, as well as the development of certain photoresists. Additional PPE is required to use this hood, solvents are not allowed, and extreme caution must be observed while at the hood.
- Tool manager: Cleanroom staff
- Location: Main Campus Cleanroom / West Campus Cleanroom
- Internal rate: Included with cleanroom access
PPE required:
- Safety glasses
- Face shield
- Chemical apron
- Green nitrile gloves
- White nitrile gloves
Chemicals Supplied:
- Resist developers
- Tetramethylammonium hydroxide (TMAH)
- Ammonium hydroxide (NH4OH)
- Hydrogen peroxide (H2O2)
Solvent hood
The solvent hood is used for basic wafer cleaning, photoresist removal, and other simple processes. Only basic PPE is required for this chemical hood.
- Tool manager: Cleanroom staff
- Location: Main Campus Cleanroom / West Campus Cleanroom
- Internal rate: Included with cleanroom access
Required PPE:
- Safety glasses
- White nitrile gloves
Supplied chemicals:
- Acetone
- Methanol
- Isopropyl alcohol (IPA)
- NMP
RCA hood
Used for extremely clean processing, the CMOS hood is used to conduct the RCA clean technique, capable of removing all organic and metallic contaminants from silicon.
- Tool manager: Cleanroom staff
- Location: Main Campus Cleanroom
- Internal rate: Included with cleanroom access
PPE required:
- Safety glasses
- Face shield
- Chemical apron
- Green nitrile gloves
- White nitrile gloves
Chemicals supplied:
- Buffered oxide etch
- Sulfuric acid (H2SO4)
- Hydrochloric acid (HCl)
- Hydrofluoric acid (HF)
- Chrome etch
- Hydrogen peroxide (H2O2)