Instrument/equipment Core/facility: Yale University Cleanroom

Sputtering and evaporation

Building:

Becton Engineering and Applied Science Center, 5th floor

About the instrument

Physical vapor deposition (PVD) is a technique for synthesizing thin films by vaporizing target solids with high energy, which then condense onto substrate materials to form a thin layer. The most commonly employed PVD methods include electron-beam evaporation, thermal evaporation, and plasma sputtering. Our cleanroom features various tools utilizing these techniques. Please note that the compatibility of materials varies with each system, so consulting with a staff member before introducing new substrates is essential. Additionally, understanding the thermal tolerance of your substrate is crucial.

Available to Yale researchers & external researchers

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Equipment

Cleanroom_Denton

Denton E-Beam Evaporator

The Denton Infinity 22 deposition system is used for depositing various thin-metal and dielectric films. It uses an electron beam and resistive heating to vaporize materials in high vacuum conditions. The electron gun has 4 pockets for 15 cc crucibles, allowing multiple layers to be deposited in situ under vacuum. Film growth is monitored by quartz crystal monitor. The 8-inch cryo pump attached to the system is capable of achieving a base pressure of 1E-6 Torr over 2 hours. Check with a staff member to determine sample compatibility before processing.

  • Tool manager: Lauren McCabe
  • Available materials: Ag, Al, Al2O3, Au, Cr, Cu, Ge, HfO2, Mo, MoO3, Ni, Pd, Pt, Si, SiO2, Ti, TiO2, W
  • Maximum sample size: 6”
  • Substrate heating: Not available
  • Base vacuum pressure: 10-6 to10-7 Torr
  • Rate: Included with cleanroom access
  • User guide: PDF
Cleanroom_PVD

PVD e-beam evaporator

The PVD e-beam evaporator has been operational since October 2020. It has a box-style UHV chamber with a loadlock, capable of loading samples up to 6” OD. The main chamber is pumped by a CTI-Torr 10 cryopump. The loadlock is pumped by a Pfeiffer turbopump. Both UHV pumps are backed by one Ebara EV-A10 dry pump. The e-beam is powered by a 10 kV Telemark power source, allowing it to evaporate metals with high melting point. There are 6 15cc pockets available, reserved for Ti/Al/Nb/Au/Cu/Pt. The best vacuum achieved so far is 10-10 torr, which happens following the niobium deposition. Typical chamber vacuum is found to be around 10-9 torr after an overnight chamber baking process. In addition, the PVD ebeam evaporator has a few unique capabilities: 
     (i) A K&R End Hall EH-200 ion source with three 10sccm MFC-controlled gas lines (oxygen, argon, hydrogen), capable of ion beam assisted deposition (IBAD);
     (ii) Two sample stages 
     - A chiller-cooled stage with rotation capability (fixed angle or constant rotation)
     - A second sample stage with tilt/rotation capability; and
     (iii) Automatic deposition enabled by (i) PVD software; (ii) Inficon deposition controller; (iii) Telemark ebeam sweep control and Telemark crucible index control.

  • Tool manager: Lauren McCabe
  • Available materials: Ti, Al, Nb, Au, Cu, Pt
  • Maximum sample size: 6”
  • Substrate heating: Not available
  • Base vacuum pressure: ~10-9 Torr
  • Rate: Included with cleanroom access
  • User guide: PDF

 

Cleanroom_Nano38

Nano38 Thermal Evaporator

The Kurt Lesker Nano38 thermal evaporator is a simple evaporator used to deposit chrome and gold. Utilizing resistive heat, it melts small amounts of metal to evaporate onto substrates at rates of about a quarter angstrom per second, with deposition controlled by a shutter. This can be used to create chrome masks for etching, gold contacts, and several other common applications.

  • Tool manager: Lauren McCabe
  • Available materials: Au, Cr
  • Maximum sample size: 6”
  • Substrate heating: Not available
  • Base vacuum pressure: ~10-7 Torr
  • Rate: Included with cleanroom access
  • User guide: PDF
Cleanroom_KJL Sputterer

Kurt J. Lesker CMS-18 Sputtering System

Sputtering is a deposition that involves a gaseous plasma generated at the target which is then eroded away by high-energy ions with the plasma. The freed target atoms deposit onto a substrate to form a thin film. Our KJL CMS-18 is a magnetron sputtering system dedicated to the deposition of Ta, Nb, and Re. The tool is a UHV system and is equipped with a heated rotation stage capable of heating to 900°C.

  • Tool manager: Lauren McCabe
  • Available materials: Nb, Ta, Re
  • Maximum sample size: 4”
  • Substrate heating: Available
  • Base vacuum pressure: ~10E-10 Torr
  • Rate: Included with cleanroom access
  • User guide: PDF