Lithography

1. Heidelberg MLA150 Maskless Aligner
2. Heidelberg μMLA Maskless Aligner
3. Suss MJB4 Mask Aligner-1
4. Suss MJB4 Mask Aligner-2
5. Heidelberg MPO100 3D Lithography System
6. Laurell Spinners
7. YES HMDS Prime Ovens

Heidelberg MLA150 Maskless Aligner

The Heidelberg MLA150 is a high-speed, maskless lithography tool capable of patterning high-resolution features, grayscale structures, and complex layouts without the need for physical masks. Users can implement design changes quickly by uploading updated CAD files. The system includes automated front- and backside alignment and can expose a 100 x 100 mm area with 1 µm features in under 10 minutes.

• Tool manager: Yong Sun
• Location: Main Campus Cleanroom
• Internal rate: Included with cleanroom access

Heidelberg μMLA Maskless Aligner

The Heidelberg μMLA is a compact maskless aligner ideal for rapid prototyping and small-scale lithography. It uses a 365 nm LED source and is capable of writing 1.0 µm features at 40 mm²/min. The system provides layer-to-layer alignment accuracy of 1000 nm across a 50 mm area and can accommodate substrates up to 6 inches.

• Tool manager: Yong Sun
• Location: West Campus Cleanroom
• Internal rate: Included with cleanroom access

Suss MJB4 Mask Aligner-1

The Suss MJB4 at Main Campus supports topside and backside infrared alignment for substrates from 5 mm up to 100 mm. It can resolve 0.7 µm features and supports five exposure modes: Soft Contact, Hard Contact, Vacuum Contact, Soft Vacuum Contact, and Gap Exposure. The light source covers 365–465 nm.

• Maximum wafer size: 6"
• Alignment travel: ±5 mm (X/Y), ±5° (theta)
• Tool manager: Yong Sun
• Location: Main Campus Cleanroom
• Internal rate: Included with cleanroom access

Suss MJB4 Mask Aligner-2

The Suss MJB4 at West Campus is a flexible and compact mask aligner designed for R&D applications. It supports single field and split field microscopy for accurate alignment and can achieve resolutions down to 0.5 µm. The system uses combined SUSS broadband optics (UV250/300/400) and supports wafers up to 100 mm.

• Feature size: ≥ 0.5 µm
• Exposure wavelengths: UV250/300/400
• Wafer size: Up to 100 mm
• Upgradable: UV nanoimprint lithography (NIL) kit available
• Tool manager: Yong Sun
• Location: West Campus Cleanroom
• Internal rate: Included with cleanroom access

Heidelberg MPO100 3D Lithography System

The Heidelberg MPO100 is a state-of-the-art 3D lithography system based on Two-Photon Polymerization (TPP) and voxel tuning. It achieves feature sizes down to 100 nm and scan speeds over 1000 mm/s. Applications include micro-optics, photonics, micromechanics, biomedical engineering, and quantum devices. Infinite Field-of-View (IFoV) mode supports large-area, stitching-free prints.

• Tool manager: Yong Sun
• Location: Main Campus Cleanroom
• Internal rate: Included with cleanroom access

Laurell Spinners

Laurell spinners are benchtop systems for applying photoresist and spin-on materials. Samples are vacuum-clamped and spun using programmable recipes. Dedicated spinners are available for positive, negative, and e-beam resists at both Main and West Campus. Please consult with staff for appropriate spinner assignment.

• Tool manager: Ida Sadeghi
• Location: Main Campus Cleanroom / West Campus Cleanroom
• Internal rate: Included with cleanroom access

YES HMDS Prime Ovens

The YES HMDS Prime Oven dehydrates substrates and applies HMDS vapor to enhance photoresist adhesion. It operates at high temperature and low pressure for consistent results and minimal waste. This tool provides superior surface preparation compared to traditional HMDS methods.

• Tool manager: Yong Sun
• Location: Main Campus Cleanroom
• Internal rate: Included with cleanroom access