Back-end processing
Yong Sun
DirectorAbout the instruments
Before and after vacuum processing steps, samples often require bulk physical modification, separation from the wafer, and other post-processing steps. With proper handling and appropriate equipment selection, damage can be kept to a minimum during these steps, improving device functionality and yield.
Available to Yale researchers & external researchers
Equipment
Tousimis Critical Point Dryer
Supercritical drying, also called critical point drying, is a process that removes liquid from materials in a precise and controlled manner, avoiding the surface tension effects that can damage delicate structures. This technique is widely used in engineering and research, particularly in the fabrication of microelectromechanical systems (MEMS), where it prevents the collapse or deformation of microstructures during drying. It is also essential in preparing biological specimens for scanning electron microscopy, preserving fine details by minimizing shrinkage and distortion. Additionally, supercritical drying finds applications in aerogels, porous materials, and advanced coatings, enabling researchers to maintain the integrity of intricate structures for analysis and development. Its precision makes it invaluable for studying and manufacturing delicate and high-performance materials.
- Tool owner: Yeongjae Shin
- Internal rate: Included with cleanroom access
LatticeGear Scribing Tools
Yale owns a full suite of LatticeGear scribing tools, a quick and clean alternative to full-wafer dicing.
For everyday scribing, the LatticeGear FlexScribe is a straightforward solution. For cleaves where the backside of the wafer needs to be protected, consider the FlipScribe. For cleaves where precision is important, the best solution is likely the microscope-enhanced LatticeAx.
- Tool owner: Yong Sun
- Internal rate: Included with cleanroom access
HESSE Bondjet BJ855 Wire Bonder
This tool is an advanced automated wire bonder designed for precise and efficient bonding processes, particularly suited for delicate substrates and high-throughput applications. It offers high-precision, delay-free touchdown detection, advanced calibration systems, and automated features to streamline operations and minimize errors. The tool integrates flexible automation options, real-time quality control, and innovative technologies to ensure reliable performance in wire bonding. With the ability to perform up to 7 wire bonds per second, it is ideal for applications requiring speed, accuracy, and consistency.
- Tool owner: Luigi Frunzio
- Internal rate: Included with cleanroom access